First, use instructions
305AB epoxy resin is at room temperature and low temperature curing epoxy glue arc, translucent, low arc, naturally foaming, easy to operate, greenhouse curing or heat curing. Dedicated to the hairpin jewelry, lighting arc Epoxy and other bonding and die perfusion and other electronic components insulation, moisture potting, cover letters and other confidential.
Second, the nature ago harden
Main agent 305A curing agent 305B
Color: colorless, transparent colorless, transparent
Weight: 1.15 0.96
Viscosity 25 ℃: 6000-10000CPS
Third, the use conditions
1) mixing ratio: A: B = 100: 33 (weight ratio)
2) Curing conditions: 25 ℃ * 10H-12H or 55 ℃ * 2.5H (2g)
3) Use Time: 25 ℃ * 60 分钟 (100g)
The use of methods
1. Working environment: Sheng plastic containers Keep clean, A, B groups were strictly weight ratio, accurately weighed, in a clockwise stir evenly along the vessel wall to stand 3-5 minutes before use.
The operating time and the amount of the deployment of the glue, to avoid wastage. When the temperature is below 15 ℃, please be A plastic preheated to 30 ℃ and then be adjusted glue, easy to operate (low temperature glue will thicken when A ); required sealing lid after use to avoid moisture absorption and cause product obsolescence.
3. When the relative humidity is greater than 85%, the cured surface easily absorb moisture in the air, forming a layer of white mist, so when the relative humidity is greater than 85%, not suitable for room temperature curing, heat curing is recommended.
Fifth, after the hardening properties
1) Hardness: shore D (82
2) Withstanding Voltage: KV / mm 22
3) Flexural strength: Kg / mm2 37
4) Volume resistivity: Ohm3 1x1015
5) Surface resistance: Ohmm2 5X1015
6) Thermal conductivity: W / M.K 0.57
7) dielectric loss: 1KHZ 0.42
8) of high temperature: ℃ 130
9) Water absorption:% (0.15
10) Compressive strength: Kg / mm2 9.4
Performance data is at a temperature above 25 ℃, humidity of 70% typical data measured in the laboratory environment, only for reference.