For double-sided, multi-layer circuit boards and other non-metallic materials through-hole plating copper, copper layer thicker .
( 1 ) Plating reciprocation Function: Governor, can control the plating rate .
( 2 ) The product tank using village acid material, titanium heating thermostat can automatically thermostat, tank working hours, the temperature can be preset, simple and convenient operation, high degree of automation, through hole conduction rate of 100%
( 3 ) bath microcirculation system : Built-in two porous foam pipe and quiet pump so that the plating solution is formed microcirculation, improve quality through -hole plating .
The main parameters
( 1 ) Maximum board (cm): 300 * 280
( 2 ) Minimum aperture : 0.3mm
( 3 ) Output current : 0-15A
( 4 ) The maximum thickness to diameter ratio : 2.5 : 1
( 5 ) Working speed 20-50mm / s
( 6 ) the number of slots : 5