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Micro-fit 3.0 wire to board housing terminal and header connector for PCB
Micro-Fit 3.0 connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs
Eshine offers high-end harness designs specializing in high-signal, high-density and high-speed applications for fully integrated solutions
in all industries from telecommunications to automotives power and signal
The power/ signal harnesses offer wire-to-board and wire-to-wire options and enable multi-branch harnessing configurations.
Wire harnesses are produced on our fully automatic, high speed, discrete wire, IDC termination machines which assure superior quality and competitive prices.
They can be replacing Molex, JST, JAE, AMP, TYCO, Hirose, Yeonho, Civilux, Samtech ect famous parts.
Aerospace and Defense
Alternative Energy Source